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Company Overview
Widely used in the Chip Level Repair in laptop, PS3,PS4,XBOX360, Moblie Phone, etc. Rework BGA,CCGA, QFN, CSP, LGA, Micro SMD,LED etc. Automatic Romoving,Mounting and Soldering. HD Optical Alignment system for precisely mounting BGA and Components. Laser Positioning function for Fast Positioning BGA Chip and motherboard. BGA mounting accuracy within 0.01mm , Repair success rate 99.9%. Superior Safety Functions, with Emergency protection. User-friendly operation system.
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ManufacturerBusiness Type
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2011Year Established
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YesOverseas Office
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US$1.5 Million - US$2.5 MillionAnnual Export Value
Company Detail
Transparency is the foundation of our partnership. Below is a comprehensive overview of our operational metrics, from business scale to global market reach, giving you a clear picture of our capabilities.
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11-20 People Sales Staff
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ISO9000 Product Certifications
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US$1.5 Million - US$2.5 Million Annual Export Value
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North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe, Central America, Northern Europe, Southern Europe, South Asia, Domestic Market Main Markets
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Shenzhen, HK Port of Shipment
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Yes Overseas Office
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Laser Welding Machine Main Industry
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Our ServicesThe spare parts are provided for free within 1 year Lifetime technical support Free training